Print Electronics
Time To Market experts
with fast production turnaround from 24h
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Special processVIP (Via In Pad) Flat pads (for SMT assembly) with non-conductive ink and transmit thermal energy out and away from the source with conductive ink are the main advantages of via filling and copper capping process. In order to achieve a perfect results with no plating dimples and no air bubbles in the hole during filling we use an automatic process. We use Peters PP2795 material. |
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Sales inquiries Email: sales@print-e.co.il Tel: 03-9611168 ext. 109-110 |
WIP & delivery follow up Email: wip@print-e.co.il Tel: 03-9611168 ext. 201 |
Customer service Email: customerservice@print-e.co.il Tel: 03-9611168 ext. 108 |