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Special process

VIP (Via In Pad)

Flat pads (for SMT assembly) with non-conductive ink and transmit thermal energy out and away from the source with conductive ink are the main advantages of via filling and copper capping process.

In order to achieve a perfect results with no plating dimples and no air bubbles in the hole during filling we use an automatic process.

We use Peters PP2795 material. 

Sales inquiries


Tel: 03-9611168 ext. 109-110

WIP & delivery follow up


Tel: 03-9611168 ext. 201

Customer service


Tel: 03-9611168 ext. 108


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